0% Convertible Bonds $1 Billion.. Financing Card Chosen by Packaging Leader

Amkor Technology, Inc. (NASDAQ: AMKR) has set the private placement price for $1.0 billion of 0% convertible bonds due 2031 (approximately KRW 1.3 trillion), with an option for an additional $150 million on the same terms, bringing total potential proceeds to $1.15 billion. The new notes, which carry a 5.875% coupon and mature in 2033, are senior unsecured obligations guaranteed by the company’s subsidiaries and are expected to be issued and settled on May 5. The conversion price into common stock is set at approximately $106.37 per share, representing a premium of about 52.5% to Amkor’s closing price on April 30. Net proceeds are estimated at roughly $980 million (or about $1.13 billion if the full option is exercised), and will be used for general corporate purposes, including the cost of capped‐call transactions to mitigate dilution upon conversion and for capital expenditures. The securities are being offered in a private placement to qualified institutional buyers under Rule 144A of the U.S. Securities Act.

Prior to this financing, Amkor reported first-quarter 2026 results at the end of April and issued second-quarter revenue guidance of $1.75 billion to $1.85 billion. The company also announced a share-repurchase program of up to $300 million and annual capital expenditure plans of $2.5 billion to $3.0 billion.

Headquartered in Peoria, Arizona, Amkor is one of the world’s leading outsourced semiconductor assembly and test (OSAT) providers, offering back-end packaging and testing services for high-performance mobile, automotive and AI semiconductors to fabs and fabless customers worldwide. The company has secured up to $407 million in U.S. CHIPS Act subsidies and is building an advanced packaging facility in Peoria to expand domestic high-end packaging capacity in response to growing AI chip demand.